Teradek Bond 759 Overview

The Bond 759 HEVC Backpack from Teradek includes the Bond 757 Expansion Module with Cube 755 Encoder, a Node Cellular 4G LTE USB Modem (Europe/Asia), and an AB-mount battery plate.

Outstanding Cellular Connection

Node allows you to go live from almost location, even those with the poor cellular connectivity

Data Band Support

Node can operate on every 3G/4G/LTE data band in the region

Interfaces

4-pin connector with a USB adapter provide a secure connection to your Teradek device

Durable and Weather-Resistant

Node features a rugged aluminum chassis and both 1/4"-20 and 4-40 mounting options

Teradek Compatibility

  • VidiU Go/VidiU Pro
  • Cube series
  • Link/Link Pro wireless access point
  • Bond II/Pro/Expansion Module
UPC: 818264020654

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